| Specifications | STACTEG-150FA | STACTEG-300FA |
| Base Wafer | STAC-0101JY | STAC-0101JY |
| Electrode | Ni + SnAg Bump | Cu Pillar Bump |
| Bump Pitch | 150μm | 300μm |
| Bump Size | φ110μm | φ110μm |
| Bump Height | Ni5μm+SnAg75μm | Cu50um+SnAg10um |
| Passivation Opening | 70μm (Octagon) | 70μm (Octagon) |
| Polyimide Opening | φ90μm | φ90μm |
| Number of Pad | 32 pads | 32 pads |
| Number of Bump | 32 bumps + 253 Dummy bumps | 32 bumps + 64 Dummy bumps |
| <Option> | Back Side Metallization | Back Side Metallization |
