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Specifications | STACTEG-150FA | STACTEG-300FA |
Base Wafer | STAC-0101JY | STAC-0101JY |
Electrode | Ni + SnAg Bump | Cu Pillar Bump |
Bump Pitch | 150μm | 300μm |
Bump Size | φ110μm | φ110μm |
Bump Height | Ni5μm+SnAg75μm | Cu50um+SnAg10um |
Passivation Opening | 70μm (Octagon) | 70μm (Octagon) |
Polyimide Opening | φ90μm | φ90μm |
Number of Pad | 32 pads | 32 pads |
Number of Bump | 32 bumps + 253 Dummy bumps | 32 bumps + 64 Dummy bumps |
<Option> | Back Side Metallization | Back Side Metallization |