Wafer Chip Size Package (WLP) Dummy Component

WLP uses interconnection technology to effectively utilize the chip area by making it possible to form electrodes over the entire chip surface. This eliminates the need for the wire bonding space required by previous wiring methods. Also, electrodes are formed using copper posts for a simple structure.

All of this means that the area of the finished package is exactly the same compact size as the original chip. It also simplifies mounting and contributes to easier high-density mounting. WLP is the perfect choice for packaging chips used in portable telephones, digital cameras, and other applications where mounting space is severely restricted.

* Ultra thin type, Ultra miniature, Lightweight

* High current capacity and good heat radiation

* Stress buffer structure

* High reliability of WLP as semiconductor package makes KGD issues cleared.

* Cu-to-Cu wiring structure

* Include inductors of high Q value

* Possibility of SMT assembly

* Coplanarity (5 to 10 ?m)

* Available diced and left in ring or in trays.