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Click here to learn about the new Privacy Policy updates from Practical Components.Wafer Size | 8 inch |
Wafer Thickness | 725±25μm |
Chip Size | 12.0mm×10.0mm |
Pad Pitch | ① 35μm×40μm(I/O area) ② 90μm ×160µm(Staggerd area) ③ 300μm (Outer pad) |
Function | Daisy Chain |
Electrode | Electroless Ni/Au plating |
Pad Size | ① 27μm■ ② 27μm■ ③ 300μm■ |
Passivation Opening | ① 18μm● ② 18μm● ③ 280μm■ |
Bump Size | ① 23μm● ② 23μm● ③ 285μm■ |
Number of Pad |
① 7200 pads(I/O area) |
Scribe Width | 120μm |
Number of Chip | 204 chips/wafer |