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WALTS-TEG WM40-0102JY



WALTS-TEG WM40-0102JY

WALTS-TEG WM40-0102JY


Specifications
Wafer Size 8inch
Wafer Thickness 725±25μm
Chip Size 10mm×8mm
Function Daisy Chain 
Pad Size 32μm■
Passivation Opening 7μm (Octagon)
Number of Pad ① 1200 pads ② 714 pads
Electrode Cu Pillar Bump
Bump Size Φ20μm
Bump Pitch ①40μm ②300μm
Bump Height Cu15μm + SnAg8μm
Number of Chip 312 chips/wafer