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Wafer Size | 8inch |
Wafer Thickness | 725±25μm |
Chip Size | 10mm×8mm |
Function | Daisy Chain |
Pad Size | 32μm■ |
Passivation Opening | 7μm (Octagon) |
Number of Pad | ① 1200 pads ② 714 pads |
Electrode | Cu Pillar Bump |
Bump Size | Φ20μm |
Bump Pitch | ①40μm ②300μm |
Bump Height | Cu15μm + SnAg8μm |
Number of Chip | 312 chips/wafer |