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STAC-0101JY
| Specifications | |
| Wafer Size | 6inch(OrientationFlat) |
| Wafer Thickness | 550±25μm |
| Chip Size | 3.0mm ♦ |
| Pad Pitch | 300μm |
| Function | Stress Analysis by Piezoresistance Thermal Analysis by Diode Heat Generation by Resistance |
| Electrode | Al pad Cu Pillar Bump Solder Bump Au Bump |
| Pad Size | 120μm ♦ |
| Passivation Opening | 70μm (Octagon) |
| Polyimide Opening | φ90μm |
| Scribe Line Width | 80μm |
| Number of Pad | 32pads |
| <Option> | Back Side Metallization |
| ♦ Bottom Side |
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