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.4mm Pitch eWLP Dummy Wafer-Amkor
A-eWLP-Dummy Component Wafer-.4-CuPd-DC-NB 8” wafers embedded copper pads (no balls) daisy-chained 0.4mm pitch / 725um thickness.
Offered as uncut whole wafers or diced die. Backgrinding available to 200um.
Die can be packaged on Tape & Reel (pads down) or on tape/ring (no DAF).
Pad I/O |
Pad Matrix |
Pitch |
Die Sizes |
Tape & Reel |
4 |
2x2 |
0.4mm |
0.76mm |
W=8mm P=4mm |
16 |
4x4 |
0.4mm |
1.56mm |
W=8mm P=4mm |
36 |
6x6 |
0.4mm |
2.36mm |
W=12mm P=8mm |
64 |
8x8 |
0.4mm |
3.16mm |
W=12mm P=8mm |
100 |
10x10 |
0.4mm |
3.96mm |
W=12mm P=8mm |
144 |
12x12 |
0.4mm |
4.76mm |
W=12mm P=8mm |
196 |
14x14 |
0.4mm |
5.56mm |
W=12mm P=8mm |