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Dummy Components®
Amkor's new Dual Row MLF® (MicroLeadFrame®) package with 2 rows of lands is a cost effective, high performance dummy component solution for devices requiring up to 164 I/O. Typical applications include hard disk drives, USB controllers, and Wireless LAN. The small size and weight, along with excellent thermal and electrical performance, make the MLF® package an ideal choice for handheld portable applications such as cell phones and PDAs or any other application where size, weight and package performance are required issues.
Dual Row MLF |
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Part Description |
Lead Count |
Body Size |
Pitch |
Quantity |
A-DualRowMLF124-10mm-.5mm |
124 |
10mm |
.5mm |
30 |
A-DualRowMLF132-10mm-.5mm |
132 |
10mm |
.5mm |
30 |
A-DualRowMLF156-12mm-.5mm |
156 |
12mm |
.5mm |
25 |
A-DualRowMLF164-12mm-.5mm |
164 |
12mm |
.5mm |
25 |
Notes
* Parts are packaged in tubes (standard).
* Parts are available in trays or on tape and reel upon special request.
* Solder plating finishes available are 85/15 SnPb and 100% Matte Sn.
* Moisture sensitivity level is JEDEC 1.
* Process flow is same as standard "punch" MLF®.
* Small size (reduce package footprint by 50% or more and improved RF performance) and weight.
* Dummy Dual row MLF® offers enhanced thermal capability.
Part Description System
* Add "TR" to end of part number for Tape and Reel.
* Add "Sn" to end of part number for Lead-Free.