SMTA Solder Paste Test Vehicle for Miniaturized Surface Mount Technology

Optimize the stencil printing and reflow portions of SMT assembly with this SMTA test vehicle.

Consumer demand has accelerated the pace of the electronics miniaturization trend, compelling assemblers to develop robust capabilities for 01005 components and 0.3mm pitch array packages in order to remain competitive. The process of acquiring these capabilities can be complex, as they involve numerous interactive factors. To optimize the stencil printing and reflow portions of SMT assembly given the challenging new realities, a process evaluation tool has been developed that provides a turnkey solution for solder paste performance testing.

0.5 mm pitch area arrays and 0201 chip components are considered mainstream SMT; however, many assemblers continue to struggle with yields on these packages. 0.4 mm area array and 01005 components are becoming more popular in design communities, and production levels are ramping up as electronic manufacturing service providers work to develop robust processes on their SMT lines. 0.3 mm pitch devices are emerging in highly miniaturized, high-value devices, and 0.25 mm pitch and 008004 chip components are in advanced assembly technology labs for initial process development.

Given the challenging new realities, a process evaluation tool has been developed that provides a turnkey solution for solder paste performance testing.

The board can be populated with a variety of components pitch from.5mm to 008004 depending on the users needs.  Call 888-388-7808 or email to configure your kit.

Call for 888-388-7808 or email for more information.