WALTS-TEG IPHBM-0100JY

Wafer Size	8 inch
Wafer Thickness	725±25μm
Chip Size	12.0mm×10.0mm
Pad Pitch	① 35μm×40μm(I/O area) ② 90μm ×160µm(Staggerd area) ③ 300μm (Outer pad)
Function	Daisy Chain
Electrode	Electroless Ni/Au plating
Pad Size	① 27μm■ ② 27μm■ ③ 300μm■
Passivation Opening	① 18μm● ② 18μm● ③ 280μm■
Bump Size	① 23μm● ② 23μm● ③ 285μm■
Number of Pad	① 7200 pads(I/O area) ② 7456 pads(Staggered area) ③ 96 pads(Outer pad)
Scribe Width	120μm
Number of Chip	204 chips/wafer