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Advanced Wafer Technology Substrates

Part Description	W-Kit-MB50-0102	W-Kit-CC80-0104	W-Kit-FC150P-10	W-Kit-FC200P-10
Specifications			1x1	1x1
Structure	1-2-1 Build Up Substrate	1-2-1 Build Up Substrate	Rigid Substrate (both)	Rigid Substrate (both)
Layer Structure	Layer 1 Signal Layer (no via) Layer 2 ~ Layer 4 Mesh	Layer 1,2 Signal Layer (Via) Layer 3, 4 Mesh
Outline	17.0mm x 17.0mm x (0.96mmt)	187.5mm x 64.0mm x (0.36mmt)	30.0mm x 30.0mm x (0.96mmt)	30.0mm x 30.0mm x (0.86mmt)
Core Material	Core: E-679FGR Build Layer: ABF-GX13	Core: E-679FGBS Build Layer: ABF-GX92	Core: E-679FGR Build Layer: ABF-GX92	Core: E-679FGR
Solder Resist Material	PSR4000 AUS-703	PSR4000 AUS-703	PSR4000 AUS-703	PSR4000 AUS-703
Function	Daisy Chain	Daisy Chain	Daisy Chain	Daisy Chain
Land Size			Φ0.12µm	Φ0.14µm
Lead Min L/S	20µm/30µm	32µm/48µm
Number of Lead	536 lead	Peripheral: 648 lead Full Area: 400 leads	3,721 (61x61)	2,116 (46x46)
Pad Dimensions	Φ0.8µm (SR opening: Φ0.65µm)	Φ0.75µm (SR opening: Φ0.67µm)	SR opening: Φ0.80µm	SR opening: Φ0.95µm
Number of Pads	32 Pads	72 Pads	24 Pads	24 Pads
Daisy Chain			Center Area 16x15 Matrix Corner Area 15x15 four Matrix	Center Area 12x12 Matrix Corner Area 12x11 four Matrix
Surface Spec of Electrode	Electroless Ni/Au plating	Cu Cu+OSP Electroless Ni/Au plating	Electroless Ni/Au plating Cu+OSP (Option Solder Coat) Cu	Electroless Ni/Au plating Cu+OSP (Option Solder Coat) Cu
** Call Practical for custom and option kit substrate options