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Small Shrink Outline Package (SSOP)
SSOP
Small Shrink Outline Package
The Small Shrink Outline Package (SSOP) body size is compressed and the lead pitch is tightened to obtain a small version of the standard SOIC packages. Lead counts range from 8 to 64. Body sizes are 209 and 300 mils. The SSOP package is JEDEC and EIAJ compliant. The package leads are solder plated.
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SSOP Small Shrink Outline Package |
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Part Description |
Number |
Body Width |
Pitch |
Quantity |
Tape Width |
Tape Pitch |
Quantity |
|
A-SSOP14T-5.3mm |
14 |
5.3mm |
.65mm |
100 |
16mm |
12mm |
1,000 |
|
A-SSOP16T-5.3mm |
16 |
5.3mm |
.65mm |
80 |
16mm |
12mm |
1,000 |
|
A-SSOP20T-5.3mm |
20 |
5.3mm |
.65mm |
62 |
16mm |
12mm |
1,000 |
|
A-SSOP24T-5.3mm |
24 |
5.3mm |
.65mm |
66 |
16mm |
12mm |
1,000 |
|
A-SSOP28T-5.3mm |
28 |
5.3mm |
.65mm |
47 |
16/24mm |
12mm |
1,000 |
|
A-SSOP36T-7.6mm |
36 |
7.6mm |
.8mm |
31 |
24mm |
12mm |
1,000 |
|
A-SSOP48T-7.6mm |
48 |
7.6mm |
.635mm |
30 |
32mm |
12/16mm |
1,000 |
|
A-SSOP56T-7.6mm |
56 |
7.6mm |
.635mm |
26 |
32mm |
12/16mm |
500 |
Notes
* Tube quantity may vary.
* Parts available on Tape and Reel upon special request.
* 209 and 300 mil body widths.
* JEDEC and EIAJ package outline standard compliance.
* High-conductivity copper leadframes.
* Eutectic solder plating is 85/15 Sn/Pb.
* Moisture sensitivity is JEDEC level 3.
* Lead-free available with 100% Matte Sn alloy.
Part Description System
* Add "T" for Tubes or "TR" for Tape and Reel to end of part number.
* Add "ePad" to beginning of part number when ordering ExposedPad package.
* Add "Sn" to end of part number for Lead-Free.
Note: Drawings not to scale.
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