Plastic Ball Grid Array (PBGA) Dummy Component

Dummy Plastic Ball Grid Arrays (PBGA) incorporate advanced assembly processes and designs for low cost, high performance applications. PBGA dummies are designed for low inductance, improved thermal operation and enhanced SMT-ability.

All dummy PBGAs listed on this page are daisy-chained and available lead-free.

Some PBGAs are available daisy-chained. All PBGAs are available lead-free.

Notes

* Overall thickness of 1.0mm pitch PBGA packages will vary (please call for more details).

* Parts are packaged in JEDEC trays.

* Call for tape and reel quantity and availability.

* Solder ball material is eutectic 63/37 SnPb.

* All components are daisy-chained.

* Daisy-chained connections are connections between I/O (input/output) of the component.

* BT (Bismaleimide-Triazine) substrates.

* JEDEC MS-034 standard outlines.

* Ball diameter varies (see chart).

* BGA packages should be baked at 125ºC for 24 hours prior to assembly to prevent delamination during the assembly process.

* Moisture sensitivity is JEDEC level 3.

* Lead-free parts are available with (SAC405) 95.5% Sn/ 4.0% Ag/ 0.5% Cu alloy or 96.5%Sn/3.0%Ag/0.5%Cu alloy (SAC305) is also available. Sn3.5Ag is also available (call for availability).

* PBGAs are not available without solder balls.

Practical does not guarantee the chain of custody for moisture sensitivity. This is due to the factory making consolidated shipments and customers quantity being met (breaking full tray quantities).

Part Description System

Notes

* * = DC available

* Parts are packaged in JEDEC trays.

* Call for tape and reel quantity and availability.

* Solder ball material is eutectic 63/37 SnPb.

* Daisy-chained connections are connections between I/O (input/output) of the component.

* BT (Bismaleimide-Triazine) substrates.

* JEDEC MS-034 standard outlines.

* Ball diameter varies (see chart).

* BGA packages should be baked at 125ºC for 24 hours prior to assembly to prevent delamination during the assembly process.

* Moisture sensitivity is JEDEC level 3.

* Lead-free parts are available with (SAC405) 95.5% Sn/ 4.0% Ag/ 0.5% Cu alloy or 96.5%Sn/3.0%Ag/0.5%Cu alloy (SAC305) or Sn3.5Ag (call for SnAg availability)

* PBGAs are not available without solder balls.

Part Description System

* Add "TR" to end of part number for Tape and Reel.

* Add SAC405 or SAC305 or Sn3.5Ag to end of part number for Lead-Free.

Package	Pitch	Solder Ball Diameter (A)	Solder Ball Land On Package and Board	Solder Ball Height on Package (B)	Solder Joint Height After SMT* (C)
(1)PBGA	1.00	0.50	0.45	0.40	0.32
(2)PBGA	1.00	0.63	0.45	0.55	0.48
PBGA	1.27	0.76	0.63	0.60	0.52
PBGA	1.50	0.76	0.63	0.60	0.52

 

Notes

* (1) applies to 13, 15 and 17mm packages.
* (2) applies to 23, 27, 31, 35mm, 37.5mm and 40.0mm packages.

* Units = mm

Assumptions:
* 5 mils Solder Paste
* Solder Mask Defined Pad