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ChipArray® Ball Grid Array
ChipArray® Dummy (CABGA) packages are offered in laminate format and are available as Ball Grid Array. The near chip size standard outlines offer fixed body sizes and ball counts. With our dummy components the stablished SMT mounting processes and techniques are compatibly with ChipArray®. The dummy package size and design provides ideal RF operation (low inductance) for high speed applications requiring small footprints.
ChipArray® Ball Grid Array |
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Part Description |
I/O Count |
Pitch |
Body Size |
Ball Matrix |
Ball |
Quantity |
Available |
.5mm Pitch |
|
||||||
A-CABGA40-.5mm-5mm |
40 |
.5mm |
5mm |
8 x 8 |
Perimeter |
624 |
SAC405, SAC105 or SAC305 |
A-CABGA56-.5mm-6mm |
56 |
.5mm |
6mm |
10 x 10 |
Perimeter |
408 |
SAC405, SAC105 or SAC305 |
.8mm Pitch |
|||||||
A-CABGA36-.8mm-6mm |
36 |
.8mm |
6mm |
6 x 6 |
Full Array |
608 |
SAC405, SAC105 or SAC305 |
A-CABGA49-.8mm-7mm |
49 |
.8mm |
7mm |
7 x 7 |
Full Array |
476 |
SAC405, SAC105 or SAC305 |
A-CABGA64-.8mm-8mm |
64 |
.8mm |
8mm |
8 x 8 |
Full Array |
360 |
SAC405, SAC105 or SAC305 |
A-CABGA144-.8mm-12mm |
100 |
.8mm |
12mm |
13 x 13 |
Perimeter |
189 |
SAC405, SAC105 or SAC305 |
A-CABGA100-.8mm-10mm |
100 |
.8mm |
10mm |
10 x 10 |
Full Array |
250 |
SAC405, SAC105 or SAC305 |
A-CABGA160-.8mm-12mm |
160 |
.8mm |
12mm |
14 x 14 |
Perimeter |
189 |
SAC405, SAC105 or SAC305 |
A-CABGA176-.8mm-13mm |
176 |
.8mm |
13mm |
15 x 15 |
Perimeter |
160 |
SAC405, SAC105 or SAC305 |
A-CABGA192-.8mm-14mm |
192 |
.8mm |
14mm |
16 x 16 |
Perimeter |
119 |
SAC405, SAC105 or SAC305 |
A-CABGA208-.8mm-15mm |
208 |
.8mm |
15mm |
17 x 17 |
Perimeter |
126 |
SAC405, SAC105 or SAC305 |
A-CABGA288-.8mm-19mm |
288 |
.8mm |
19mm |
22 x 22 |
Perimeter |
84 |
SAC405, SAC105 or SAC305 |
1.0mm Pitch |
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A-CABGA100-1.0mm-11mm |
100 |
1.0mm |
11mm |
10 x 10 |
Full Array |
207 |
SAC405, SAC105 or SAC305 |
A-CABGA144-1.0mm-13mm |
144 |
1.0mm |
13mm |
12 x 12 |
Full Array |
160 |
SAC405, SAC105 or SAC305 |
A-CABGA196-1.0mm-15mm |
196 |
1.0mm |
15mm |
14 x 14 |
Full Array |
126 |
SAC405, SAC105 or SAC305 |
A-CABGA256-1.0mm-17mm |
256 |
1.0mm |
17mm |
16 x 16 |
Full Array |
90 |
SAC405, SAC105 or SAC305 |
Notes
* Parts are packaged in JEDEC trays when available.
* All components are available daisy-chained.
* <0.12mm (5 mil) coplanarity.
* Solder ball material is Eutectic 63/37 SnPb.
* BT (Bismaleimide-Triazine) substrates or equivalent.
* Package thickness is 1.5mm max for 0.8mm and 1.0mm pitch packages.
* Package thickness is 1.34mm max for 0.5mm pitch packages.
* Moisture sensitivity is JEDEC level 3.
* Lead-free parts are available with (SAC405) 95.5% Sn/ 4.0% Ag/ 0.5% Cu alloy or 96.5%Sn/3.0%Ag/0.5%Cu alloy (SAC305) or (SAC105) 98.5%Sn/1.0%Ag/0.5%Cu is also available.
* New: CABGA, CVBGA and CTBGA parts are available without
solder balls, which makes the package LGA. See page 27.
Part Description System
* Add "TR" to end of part description for Tape and Reel
* Add "SAC405", "SAC105" or SAC305" to end of part description for Lead-Free.
Package Pitch |
A |
B |
C |
D |
1.00/0.80mm |
0.46mm |
0.48m (± 0.05mm) |
0.36mm (± 0.05mm) |
0.30mm (± 0.05mm) |
0.50mm |
0.30mm |
0.32mm (± 0.05mm) |
0.19mm (± 0.05mm) |
0.17mm (± 0.03mm) |
Note: Typical motherboard non-solder mask defined pad:
*0.50 pitch = 0.28
*0.80 pitch = 0.30
*1.00 pitch = 0.38
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