| Free Size Cut TEG | TEG0306 | TEG0408 | TEG0510 | |
| Wafer Size | 8 inch | 8 inch | 8 inch | |
| Wafer Thickness | 400μm(or more) | 400μm(or more) | 400μm(or more) | |
| Cut Size (Scribe Line Included) |
Min | 600μm×600μm | 800μm×800μm | 1000μm×1000μm |
| Pad Pitch | 300μm | 400μm | 500μm | |
| Function | Daisy Chain | Daisy Chain | Daisy Chain | |
| Electrode | Ball Mounted Solder Bump | Ball Mounted Solder Bump | Ball Mounted Solder Bump | |
| Post Size | 175μm | 200μm | 250μm | |
| Number of Chip | 79,257 chips/wafer | 44,161 chips/wafer | 28,212 chips/wafer |
