WALTS-TEG ITO1102

Specifications
Wafer Size	8 inch
Wafer Thickness	725±25μm
Chip Size	20.0mm
Layer	Layer1: cu wiring
Metal Material	Cu
Cu Thickness	1.5 ~ 2.5μm
Number of Pad	56 pads
Pad Size	160μm
Measurement Pad Size	2.0mm / 0.9mm
Number of Chip	57 chips/wafer
Evaluation Pattern	・Comb pattern Comb pattern L/S dimension ①L/S=1.0μm/1.0μm ②L/S=1.5μm/1.5μm ③L/S=2.0μm/2.0μm ④L/S=10.0μm/10.0μm *interdigital pattern length：2mm ・Wiring pattern for break check 10.0μm, 2.0μm, 1.5μm, 1.0μm(length: 2.0mm, 1.0mm)