| Specifications | |||||||
| Wafer Size | 8inch(Notch) | ||||||
| Wafer Thickness | 725±25μm | ||||||
| Chip Size | 10.0mm ■ | ||||||
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| Scribe Line Width | 120μm | ||||||
| Function | Thermal Analysis by Diode Heat Generation by Resistance Insulation Resistance Test by High Voltage Plate |
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| Electrode Material | Al pad | ||||||
| Number of Pad | 12 pads | ||||||
| Number of Chip | 224 chips/wafer | ||||||
| Maximum Output | Max.55W/Chip | ||||||
| Back Side Metallization | |||||||
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