Wafer Size | 8 inch |
Wafer Thickness | 725±25µm |
Chip Size | 10.0mm×8.0mm |
Pad Pitch | ① 35μm×40μm(I/O area) ② 90μm x 160µm(Staggerd area) |
Function | Daisy Chain |
Electrode | Cu pillar |
Pad SIze | ① 27μm■ ② 27μm■ |
Passivation Opening | ① 8μm● ② 8μm● |
Bump Size | ① 18μm● ② 18μm● ③ 18µm● |
Number of Pad | ①7200 pads(I/O area) ②6544 pads(Staggerd area) |
Number of Bump | 7200 bamps(I/O area) ②6544 bamps(Staggerd area) ③912 bamps(Dummy bump area) |
Scribe Width | 120μm |
Number of Chip | 312 chips/wafer |