Practical Components-KIT FC120
| Wafer Size | 8inch |
| Wafer Thickness | 725±25μm |
| Chip Size | 10mm |
| Bump Pitch | 120μm |
| Pad Config | Area |
| Electrode | Cu Pillar |
| Pad Size | 80μm |
| Passivation Opening | φ20μm |
| Ployimide Opening | φ40μm |
| UBM Size | φ65μm |
| Bumb Size | φ60μm |
| Scribe Width | 100μm |
| Number of Pad | 5776 pads/chip (76x76) |
| Number of Chip | 208 chips/wafer |
