| Specifications | TYPE-A | TYPE-B |
| Wafer Size | 6 inch | 6 inch |
| Wafer Thickness | 625±25μm | 625±25μm |
| Chip Size | 6.0mm ♦ | 6.0mm ♦ |
| Metal Thickness | Al-Si 3μm | Al-Si 4.5μm |
| Function | BondabilityCheck | BondabilityCheck |
| Pad config | Plane | Plane |
| Pad Size | 5060μm × 2420μm | 5060μm × 2420μm |
| 270μm 5300μm | 270μm × 5300μm | |
| Passivation opening | 5040μm × 2400μm | 5040μm × 400μm |
| 250μm × 5280μm | 250μm × 5280μm | |
| Scribe width | 100μm | 100μm |
| ♦ Bottom Side |
