| Specifications | |
| Wafer Size | 8inch (Notch) |
| Wafer Thickness | 725±25μm |
| Chip Size | 3.0mm ♦ |
| Pad Pitch | 300μm |
| Function | Thermal Analysis by Diode Heat Generation by Resistance |
| Electrode | Al pad Cu Pillar Bump Solder Bump Au Bump |
| Pad Size | 120μm ♦ |
| Passivation Opening | 70μm (Octagon) |
| Polyimide Opening | φ90μm |
| Scribe Line Width | 80μm |
| Number of Pad | 32pads |
| Maximum Output | Max. 14.5W/Chip |
| <Option> | Back Side Metallization |
| ♦ Bottom Side |
