Specifications | |
Wafer Size | 8inch (Notch) |
Wafer Thickness | 725±25μm |
Chip Size | 3.0mm ♦ |
Pad Pitch | 300μm |
Function | Thermal Analysis by Diode Heat Generation by Resistance |
Electrode | Al pad Cu Pillar Bump Solder Bump Au Bump |
Pad Size | 120μm ♦ |
Passivation Opening | 70μm (Octagon) |
Polyimide Opening | φ90μm |
Scribe Line Width | 80μm |
Number of Pad | 32pads |
Maximum Output | Max. 14.5W/Chip |
<Option> | Back Side Metallization |
♦ Bottom Side |