| Specifications | ||
| Wafer Size | 8 inch (Φ200mm) | |
| Bump Area | Φ193mm | |
| Wafer Thickness | 725μm | |
| Bump Pitch |
500um |
|
| Bump Size | Φ330um | |
| Bump Height | 250um | |
| Bump Material | Solder (SAC305) | |
| Chip Pitch |
2000um |
|
| Scribe Line Width | 100um | |
| PBO Thickness | 4um | |
| PBO Diameter | 240um | |
| UBM Thickness | 3um | |
| UBM Diameter | 280um | |
