| Specifications | FBW200-0001JY | FBW150-0001JY | FBW130-0001JY | FBW100-0001JY | FBW80-0001JY |
| Wafer Size | 8 inch | 8 inch | 8 inch | 8 inch | 8 inch |
| Wafer Thickness | 725±25μm | 725±25μm | 725±25μm | 725±25μm | 725±25μm |
| Bump Pitch | 200μm | 150μm | 130μm | 100μm | 80μm |
| Function | x | x | x | x | x |
| Electrode | Cu Pillar | Cu Pillar | Cu Pillar | Cu Pillar | Cu Pillar |
| Bump Size | φ90μm | φ75μm | φ65μm | φ50μm | φ40μm |
| Bump Height | Max.60μm | Max.60μm | Max.60μm | Max.60μm | Max.50μm |
