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Thin Shrink Small Outline Package
The Thin Shrink Small Outline Package (TSSOP) offers smaller body sizes, smaller lead pitches and package thickness (0.9mm thick) than standard SOIC packages. Body widths are 3.0mm, 4.4mm and 6.1mm. Lead counts range from 8 to 80. This package conforms to JEDEC package outlines.
TSSOP Thin Shrink Small Outline Package |
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Part Description |
Number |
Body |
Pitch |
Tape |
Tape |
Quantity |
Quantity |
A-TSSOP8T-3.0mm |
8 |
3.0mm |
.65mm |
12mm |
8mm |
98 |
2,500 |
A-TSSOP8T-4.4mm |
8 |
4.4mm |
.65mm |
12/16mm |
8mm |
100 |
1,000/2,500 |
A-TSSOP10T-3.0mm |
10 |
3.0mm |
.5mm |
12mm |
8mm |
98 |
2,500 |
A-TSSOP14T-4.4mm |
14 |
4.4mm |
.65mm |
12/16mm |
8mm |
96 |
1,000/2,500 |
A-TSSOP16T-4.4mm |
16 |
4.4mm |
.65mm |
12/16mm |
8mm |
96 |
1,000/2,500 |
A-TSSOP20T-4.4mm |
20 |
4.4mm |
.65mm |
16mm |
8/12mm |
74 |
1,000/2,500 |
A-TSSOP24T-4.4mm |
24 |
4.4mm |
.65mm |
16mm |
8/12mm |
62 |
1,000/2,500 |
A-TSSOP28T-4.4mm |
28 |
4.4mm |
.65mm |
16mm |
8/12mm |
50 |
1,000 |
A-TSSOP28T-6.1mm |
28 |
6.1mm |
.65mm |
24mm |
12mm |
50 |
1,000 |
A-TSSOP44T-4.4mm |
44 |
4.4mm |
.5mm |
24mm |
12mm |
42 |
1,000 |
A-TSSOP48T-6.1mm |
48 |
6.1mm |
.5mm |
24mm |
12mm |
39 |
1,000 |
A-TSSOP56T-4.4mm |
56 |
4.4mm |
.4mm |
24mm |
12mm |
42 |
1,000 |
A-TSSOP56T-6.1mm |
56 |
6.1mm |
.5mm |
24mm |
12mm |
35 |
1,000 |
A-TSSOP64T-6.1mm |
64 |
6.1mm |
.5mm |
N/A |
N/A |
28 |
N/A |
A-TSSOP80T-6.1mm |
80 |
6.1mm |
.4mm |
N/A |
N/A |
28 |
N/A |
Notes
* 0.9mm body thickness for 4.4 and 6.1mm body widths.
* 0.85mm body thickness for 3.0mm body width.
* JEDEC package outline is standard.
* High conductivity copper leadframes.
* Very low-stress mold compound.
* Tube quantity may vary.
* Parts available on Tape and Reel upon request..
* Lead-free available with 100% Matte Sn alloy.
Part Description System
* Add "T" for Tubes or "TR" for Tape and Reel to end of part number.
* Add "Sn" to end of part number for Lead-Free.
TSSOP Package
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