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Amkor's MicroLeadFrame® Dummy Package (MLF®) is a near CSP plastic encapsulated package with a copper leadframe substrate. This package uses perimeter lands on the bottom of the package to provide electrical contact to the PWB. The dummy MLF package also offers Amkor's ExposedPad technology as a thermal enhancement by having the die attach paddle exposed on the bottom of the package surface to provide an efficient heat path when soldered directly to the PWB.
MLF®€”MicroLeadFrame® |
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Part Description |
Lead Count |
Body Size |
Pitch |
Quantity |
.4mm Pitch |
||||
A-MLF28-4mm-.4mm |
28 |
4mm |
.4mm |
75 |
A-MLF48-6mm-.4mm |
48 |
6mm |
.4mm |
50 |
A-MLF88-10mm-.4mm |
88 |
10mm |
.4mm |
30 |
A-MLF100-12mm-.4mm |
100 |
12mm |
.4mm |
25 |
.5mm Pitch |
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A-MLF12-3mm-.5mm |
12 |
3mm |
.5mm |
100 |
A-MLF16-3mm-.5mm |
16 |
3mm |
.5mm |
100 |
A-MLF20-4mm-.5mm |
20 |
4mm |
.5mm |
75 |
A-MLF24-4mm-.5mm |
24 |
4mm |
.5mm |
75 |
A-MLF28-5mm-.5mm |
28 |
5mm |
.5mm |
60 |
A-MLF32-5mm-.5mm |
32 |
5mm |
.5mm |
60 |
A-MLF36-6mm-.5mm |
36 |
6mm |
.5mm |
50 |
A-MLF40-6mm-.5mm |
40 |
6mm |
.5mm |
50 |
A-MLF44-7mm-.5mm |
44 |
7mm |
.5mm |
43 |
A-MLF48-7mm-.5mm |
48 |
7mm |
.5mm |
43 |
A-MLF52-8mm-.5mm |
52 |
8mm |
.5mm |
37 |
A-MLF56-8mm-.5mm |
56 |
8mm |
.5mm |
37 |
A-MLF64-9mm-.5mm |
64 |
9mm |
.5mm |
33 |
A-MLF68-10mm-.5mm |
68 |
10mm |
.5mm |
30 |
A-MLF72-10mm-.5mm |
72 |
10mm |
.5mm |
30 |
.65mm Pitch |
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A-MLF8-3mm-.65mm |
8 |
3mm |
.65mm |
100 |
A-MLF16-4mm-.65mm |
16 |
4mm |
.65mm |
75 |
A-MLF20-5mm-.65mm |
20 |
5mm |
.65mm |
60 |
A-MLF28-6mm-.65mm |
28 |
6mm |
.65mm |
50 |
A-MLF32-7mm-.65mm |
32 |
7mm |
.65mm |
43 |
A-MLF44-9mm-.65mm |
44 |
9mm |
.65mm |
33 |
.8mm Pitch |
||||
A-MLF12-4mm-.8mm |
12 |
4mm |
.8mm |
75 |
A-MLF16-5mm-.8mm |
16 |
5mm |
.8mm |
60 |
A-MLF20-6mm-.8mm |
20 |
6mm |
.8mm |
50 |
A-MLF28-7mm-.8mm |
28 |
7mm |
.8mm |
43 |
Notes
* Dummy Parts are packaged in tubes (standard).
* Dummy Parts are available in trays or on tape and reel upon special request.
* Solder plating finish available is 100% Matte Sn.
* Moisture sensitivity level is JEDEC 1.
* Two MLF® designs are available: Punch or Saw (see the cross-section drawing).
* Small size (50% space reduction as
compared with TSSOP).
* MLF® package is a near CSP plastic
encapsulated package with a copper
leadframe substrate.
* MLF® is also known as QFN, MCC or MLP.
* 0.6mm to 1.5mm maximum height
* Body sizes ranging from 3 x 3mm
to 12 x 12mm.
* Pin counts and body sizes change on an ongoing basis.
Please call for updated listing of available packages.
Part Description System
Cross-Sections MLF®
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