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The Thin Shrink Small Outline Package (TSSOP) offers smaller body sizes and smaller lead pitches with package thickness (0.9mm thick) over standard SOIC packages. Body widths are 3.0mm, 4.4mm and 6.1mm. Lead counts range from 8 to 80. This package conforms to JEDEC package outlines. Parts are also available as an ExposedPad™ (ePad™) package.

TSSOP Package
ExposedPad (ePad) TSSOP  ExposedPad (epad) TSSOP Package

TSSOP Thin Shrink Small Outline Package
Part Number Number
of Pins
Body
Width
Pitch Tape
Width
Tape
Pitch
Qty
Per
Tube
Qty
Per Reel
TSSOP8T-3.0mm 8 3.0mm .65mm 12mm 8mm 98 2,500
TSSOP8T-4.4mm 8 4.4mm .65mm 12/16mm 8mm 100 1,000/2,500
TSSOP10T-3.0mm 10 3.0mm .65mm 12mm 8mm 98 2,500
TSSOP14T-4.4mm 14 4.4mm .65mm 12/16mm 8mm 96 1,000/2,500
TSSOP16T-4.4mm 16 4.4mm .65mm 12/16mm 8mm 96 1,000/2,500
TSSOP20T-4.4mm 20 4.4mm .65mm 16mm 8/12mm 74 1,000/2,500
TSSOP24T-4.4mm 24 4.4mm .65mm 16mm 8/12mm 62 1,000/2,500
TSSOP28T-4.4mm 28 4.4mm .65mm 16mm 8/12mm 50 1,000
TSSOP28T-6.1mm 28 6.1mm .65mm 24mm 12mm 50 1,000
TSSOP30T-4.4mm 30 4.4mm .5mm 16mm 8mm 62 1,000
TSSOP32T-6.1mm 32 6.1 .65mm 24mm 12mm 44 1,000
TSSOP38T-4.4mm 38 4.4mm .5mm 16mm 8/12mm 50 1,000
TSSOP38T-6.1mm 38 6.1mm .65mm 24mm 12mm 39 1,000
TSSOP44T-4.4mm 44 4.4mm .5mm 24mm 12mm 42 1,000
TSSOP48T-4.4mm 48 4.4mm .4mm 16mm 8mm 50 1,000
TSSOP48T-6.1mm 48 6.1mm .5mm 24mm 12mm 39 1,000
TSSOP56T-4.4mm 56 4.4mm .4mm 24mm 12mm 42 1,000
TSSOP56T-6.1mm 56 6.1mm .5mm 24mm 12mm 35 1,000
TSSOP64T-6.1mm 64 6.1mm .5mm N/A N/A 28 N/A
TSSOP80T-6.1mm 80 6.1mm .4mm N/A N/A 28 N/A
  • 0.9mm body thickness for 4.4 and 6.1mm body widths.
  • 0.85mm body thickness for 3.0mm body size.
  • JEDEC package outline is standard.
  • High conductivity copper leadframes.
  • Very low-stress mold compound.
  • Tube quantity may vary.
  • Tape type is plastic.
  • All pin counts listed are available as an ePad™ package.
  • Lead-free parts are available with SN/Cu alloy.

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