See our illustrated design guide/catalog for an extensive list of dummy components, SMD production tools and equipment, PCB practice kits and other products designed to save you money and improve your process.
Practical Dummy Components is the exclusive distributor of mechanical samples for Amkor Technology as well as distributing components from most other leading SMD manufacturers including FlipChip International. Practical has a worldwide distribution network and in-stock availability of most popular package types. Practical distributes both of SMT and through-hole Components.
Dummy SMT components are available in all popular IC fine pitch packages (test die) including Lead-Free Rohs/WEEE compliant formulations. Package on Package (PoP), BGA, TSSOP, QFP, TSOP, CSP, Flip Chip, LQFP, Melf, QFP, PBGA, SSOP, Surface Mount Resistors, (SMR), Capacitors, Surface Mount Capacitors, (SMC) and most components are available with daisy chain.
Practical is also a leader in solder training kits and PCB training and test boards partnering with companies like Cookson, AIM, Tessera, Indium and Amkor. Practical also supplies Training Aids, IPC training and certification supplies and various electronic assembly tools and supplies.
Dummies save money! In cases where only mechanical characteristics are required, dummy components can be used instead of live, functioning components. Since there is no expensive die inside the package, the cost for performing mechanical testing is significantly lower.
A Practical Dummy Component is the exact mechanical equivalent of a live component used only when the physical properties of the components are required. These components can cost as much as 80 percent less than live components, making the ideal for testing of solder processes, machine setup lead-free conversion, thermal profiling, solder training and other process evaluations where only the mechanical characteristics not the functioning components are required.

Amkor's ChipArray® range of packages consists of laminate-based ball grid array (BGA) packages that are compatible with established SMT mounting processes.
The 0.3 mm CVBGA is a 8x8 mm, 368, 0.30 mm solder ball pitch, two-layer thin core substrate with an Ni/Au BGA finish that uses a HL832NX-A (60 µm core) and AUS 410 solder mask. The 0.3 mm CVBGA dummy component is ideal to train, test and qualify this new technology.
Offered with OSP, ImAg, & ENIG finishes