Quick Link to: Dual Row MicroLeadFrame® Component Drawings
Amkor's
new Dual Row
MicroLeadFrame® package with 2 rows of lands
is a cost effective, high performance solution for devices requiring
up to 164 I/O. Typical applications include hard disk drives, USB controllers,
and Wireless LAN. The small size and weight, along with excellent thermal
and electrical performance, make the MicroLeadFrame® package an ideal choice for
handheld portable applications such as cell phones and PDAs or any other
application where size, weight and package performance are required issues.
For more information see Amkor's parts index: www.amkor.com/products/parts/index.cfm


Notes:
For recommended kit, visit this kit page....