Practical Components
dummy components, tools and kits
Dual Row MicroLeadFrame®
Ball Grid Array
Quick Link to: Dual Row MicroLeadFrame® Component Drawings
Amkor's
new Dual Row
MicroLeadFrame® package with 2 rows of lands
is a cost effective, high performance solution for devices requiring
up to 164 I/O. Typical applications include hard disk drives, USB controllers,
and Wireless LAN. The small size and weight, along with excellent thermal
and electrical performance, make the MicroLeadFrame® package an ideal choice for
handheld portable applications such as cell phones and PDAs or any other
application where size, weight and package performance are required issues.
For more information see Amkor's parts index: www.amkor.com/products/parts/index.cfm
Notes:
- Parts are packaged in tubes (standard).
- Parts are available in trays or on tape and reel upon special request.
- Solder plating finishes available are 85/15 SnPb and 100% Matte Sn.
- Moisture sensitivity level is JEDEC 1.
- Process flow is same as standard “punch” MLF®.
- Small size (reduce package footprint by 50% or more and improved RF performance) and weight.
- Dual row MLF® offers enhanced thermal capability.
For recommended kit, visit this kit page....
