Very Thin ChipArray (CVBGA) Dummy Component


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CVBGA
Very Thin
ChipArray
® BGA

The ChipArray® (CVBGA) dummy is a new package offering by Amkor that has a 0.4mm pitch. In addition to the standard core ChipArray® dummy package (CABGA and CTBGA), Amkor offers thinner mold cap thickness of 1.0mm max. By utilizing a thin core laminate, much denser routing can be achieved, thereby enabling more I/O's in a given footprint. Due to their small size and I/O density, Amkor's ChipArray® product family is an excellent choice for new devices requiring a small footprint and low mounted height. Dummy components enable you to prototype, test and qualify this component.

CVBGA Very Thin ChipArray® BGA

Part Description

I/O Count

Pitch

Body Size

Ball
Matrix

Ball
Alignment

Quantity
Per Tray

Available Lead-Free Alloys

A-CVBGA97-.4mm-5mm

97

.4mm

5mm

10 x 10

Full Array

360

SAC405, SAC305 or SAC105

A-CVBGA360-.4mm-10mm

360

.4mm

10mm

23 x 23

Perimeter

250

SAC405, SAC305 or SAC105

A-CVBGA432-.4mm-13mm

432

.4mm

13mm

31 x 31

Perimeter

160

SAC405, SAC305 or SAC105

Notes

* Parts are packaged in JEDEC trays.

* All components are daisy-chained.

* Moisture sensitivity is JEDEC level 3.

* Solder ball material is available with Eutectic 63/37 SnPb.

* Lead-free parts are available with 95.5% Sn/ 4.0% Ag/ 0.5% Cu (SAC405) alloy or 96.5% Sn/ 3.0% Ag/ 0.5% Cu (SAC305) or (SAC105) 98.5%Sn/1.0%Ag/0.5%Cu.

* New: CVBGA ,CTBGA and CABGA parts are available without solder ball, which makes the package LGA. See page 27.

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Part Description System

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* Add TR to end of Part Description for Tape and Reel.

* Add SAC405 or SAC305 or SAC105 to end of part number for Lead-Free.

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