| Specifications | STD | ||||
| Wafer Size | 8 inch (Notch) | ||||
| Wafer Thickness | 725±25μm | ||||
| Chip Size | 12.0mm ♦ | ||||
| Function | Daisy Chain & Migration | ||||
| Pad Pitch |
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| Electrode | Cu Pillar | ||||
| Pad Size | 54μm ♦ | ||||
| Bump Size | φ31μm | ||||
| Passivation opening | 48μm ♦ | ||||
| Scribe width | 120μm | ||||
| Number of Bump/Pad |
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| Number of Chip | 177 chips/wafer | ||||
| ♦ Bottom Side |
