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Very Thin
ChipArray® BGA
The ChipArray® (CVBGA) dummy is a new package offering by Amkor that has a 0.4mm pitch. In addition to the standard core ChipArray® dummy package (CABGA and CTBGA), Amkor offers thinner mold cap thickness of 1.0mm max. By utilizing a thin core laminate, much denser routing can be achieved, thereby enabling more I/O's in a given footprint. Due to their small size and I/O density, Amkor's ChipArray® product family is an excellent choice for new devices requiring a small footprint and low mounted height. Dummy components enable you to prototype, test and qualify this component.
CVBGA Very Thin ChipArray® BGA |
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Part Description |
I/O Count |
Pitch |
Body Size |
Ball |
Ball |
Quantity |
Available Lead-Free Alloys |
A-CVBGA97-.4mm-5mm |
97 |
.4mm |
5mm |
10 x 10 |
Full Array |
360 |
SAC405, SAC305 or SAC105 |
A-CVBGA360-.4mm-10mm |
360 |
.4mm |
10mm |
23 x 23 |
Perimeter |
250 |
SAC405, SAC305 or SAC105 |
A-CVBGA432-.4mm-13mm |
432 |
.4mm |
13mm |
31 x 31 |
Perimeter |
160 |
SAC405, SAC305 or SAC105 |
Notes
* Parts are packaged in JEDEC trays.
* All components are daisy-chained.
* Moisture sensitivity is JEDEC level 3.
* Solder ball material is available with Eutectic 63/37 SnPb.
* Lead-free parts are available with 95.5% Sn/ 4.0% Ag/ 0.5% Cu (SAC405) alloy or 96.5% Sn/ 3.0% Ag/ 0.5% Cu (SAC305) or (SAC105) 98.5%Sn/1.0%Ag/0.5%Cu.
* New: CVBGA ,CTBGA and CABGA parts are available without solder ball, which makes the package LGA. See page 27.
Part Description System
* Add TR to end of Part Description for Tape and Reel.
* Add SAC405 or SAC305 or SAC105 to end of part number for Lead-Free.
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