Practical Components
dummy components, tools and kits
SOIC/SOJ
Small Shrink Outline Package
Small Outline
- SOIC/SOJ Small Outline Integrated Circuit
- HSOP Heat Slug Automotive Power Pkg
- TSSOP Thin Shrink Small Outline Pkg—Amkor
- SSOP Small Shrink Outline Pkg—Amkor
- TSSOP Thin Shrink Small Outline Pkg
- PLCC Plastic Leaded Chip Carrier
The Small Shrink Outline Package (SSOP) body size is compressed and the lead pitch is tightened to obtain a small version of the standard SOIC packages. Lead counts range from 8 to 64. Body sizes are 209 and 300 mils. The SSOP package is JEDEC and EIAJ compliant. The package leads are solder plated.
| SSOP Small Shrink Outline Package | ||||||||
|---|---|---|---|---|---|---|---|---|
| Drawing | Part Number | Number of Pins |
Body Width |
Pitch | Qty Per Tube |
Tape Width |
Tape Pitch |
Qty 13" Reel |
| Drawing | SSOP8T-5.3mm | 8 | 5.3mm | .65mm | 156 | 12mm | 8mm | 2,500 |
| SSOP14T-5.3mm | 14 | 5.3mm | .65mm | 100 | 16mm | 12mm | 1,000 | |
| SSOP16T-5.3mm* | 16 | 5.3mm | .65mm | 80 | 16mm | 12mm | 1,000 | |
| SSOP20T-5.3mm | 20 | 5.3mm | .65mm | 62 | 16mm | 12mm | 1,000 | |
| SSOP24T-5.3mm | 24 | 5.3mm | .65mm | 66 | 16mm | 12mm | 1,000 | |
| SSOP28T-5.3mm | 28 | 5.3mm | .65mm | 47 | 16/24mm | 12mm | 1,000 | |
| Drawing | SSOP48T-7.6mm | 48 | 7.6mm | 1.27mm | 30 | 32mm | 12/16mm | 1,000 |
| Drawing | SSOP56T-7.6mm | 56 | 7.6mm | 1.27mm | 26 | 32mm | 12/16mm | 500 |
| SSOP64T-10.2mm | 64 | 10.2mm | .8mm | — | 44mm | 16/24mm | 500 | |
- (*) Available as an ExposedPad™ SSOP Package by Amkor. ExposedPad™ can increase heat dissipation by as much as 110% over standard packages.
- Tube quantity may vary.
- Tape type is plastic.
- 209 and 300 mil body widths.
- JEDEC and EIAJ package outline standard compliance.
- High-conductivity copper leadframes.
- Solder plate lead finish.
- Moisture sensitivity is JEDEC level 3.
- Lead-free parts are available with Sn/Cu alloy.
