Practical Components
dummy components, tools and kits
MCC (QFN)
Microchip Carrier (Quad Flat No-Lead)
Based on copper-made lead frame, Microchip Carrier (MCC) or Quad Flat No-Lead (QFN) uses half-encapsulation technology to expose the rear side of the die pad and the tiny fingers, which are used to connect the chip and bonding wire with the PCB. Providing both thermal and electrical enhancement, MCC is a cost-effective choice over other leadless packages due to its economical materials and simpler packaging process.
| MCC (QFN) Microchip Carrier (Quad Flat No-Lead) | ||||
|---|---|---|---|---|
| Part Number | Lead Count | Pitch | Body Size | Quantity Per Tray |
| 0.5mm Pitch | ||||
| QFN16-.5mm-3mm | 16 | .5mm | 3mm | — |
| QFN20-.5mm-4mm | 20 | .5mm | 4mm | 416 |
| QFN24-.5mm-4mm | 24 | .5mm | 4mm | 416 |
| QFN28-.5mm-5mm | 28 | .5mm | 5mm | 576 |
| QFN32-.5mm-5mm | 32 | .5mm | 5mm | 576 |
| QFN44-.5mm-7mm | 44 | .5mm | 7mm | 416 |
| QFN48-.5mm-7mm | 48 | .5mm | 7mm | 416 |
| QFN56-.5mm-8mm | 56 | .5mm | 8mm | 348 |
| QFN68-.5mm-10mm | 68 | .5mm | 10mm | 250 |
| 0.65mm Pitch | ||||
| QFN32-.65mm-7mm | 32 | .65mm | 7mm | 416 |
| QFN44-.65mm-9mm | 44 | .65mm | 9mm | — |
| 0.8mm Pitch | ||||
| QFN32-.8mm-7mm | 32 | .8mm | 7mm | 416 |
- Parts have exposed die pad (ground bond)
- Body sizes ranging from 3x3 to 10x10mm
- Solder plating is 85/15 Sn/Pb
- Parts packaged in matrix trays
- MCC (QFNs) are available daisy-chained. Please call for more details.
- Available lead-free with Ag/Pd finish. Please call for more details.
