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*HDP : High Density Plasma
Specifications | MB6020-0102JY |
Wafer Size | 8 inch |
Wafer Thickness | 725±25μm |
Chip Size | 3.0mm ♦ |
Pad Pitch | 60/55/50/45/40/35/30/25/20μm |
Function | Daisy Chain |
Bump Size | - |
Bump Height | - |
Pad Size |
(57×110μm) (52×110μm) (47×110μm) |
Passivation Opening | (53×100μm) (48×100μm) (43×100μm) (38×100μm) (33×100μm) (28×100μm) (23×100μm) (18×100μm) (13×100μm) |
Number of Pad |
(40x4) (40x4) (38x4) |
Number of Chip | 3016 chips/wafer |
Polyimide (Option) | - |
Evaluation KIT | - |
♦ Bottom Side |