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Ceramic Quad Flat Pack (CQFP)



Ceramic Quad Flat Pack (CQFP)

Ceramic Quad Flat Pack (CQFP)

Ceramic Quad Flat Pack (CQFP)

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CQFP

CQFPs are hermetic packages consisting of true pieces of dry pressed ceramic surrounding a uniformed leadframe with tie bar attached. Lead counts for this package range from 14 to 304, with lead pitch ranging from 15.7mil to 50mils. Package leads are gold or Kovar finish and can be solder-coated by special request. Lids are optional for CQFPs, which are sealed over the package cavity at temperatures from 400° to 460° C.

CQFP Ceramic Quad Flat Pack

Part Description

Number
of Pins

Body Size

Pitch

(Inch)

(mm)

52CQFP-19.0mm-1.27mm

52

.750" sq

19.0mm sq

1.27mm

68CQFP-24.1mm-1.27mm

68

.950" sq

24.1mm sq

1.27mm

84CQFP-16.5mm-.65mm

84

.650" sq

16.5mm sq

.65mm

100CQFP-19.0mm-.65mm

100

.750" sq

19.0mm sq

.65mm

132CQFP-24.1mm-.65mm

132

.950" sq

24.1mm sq

.65mm

144CQFP-26.6mm-.65mm

144

1.050" sq

26.6mm sq

.65mm

172CQFP-29.2mm-.65mm

172

1.150" sq

29.2mm sq

.65mm

196CQFP-32.0mm-.50mm

196

1.260" sq

32.0mm sq

.50mm

Notes

* CQFPs are available with or without combo lid.

* Pins are flat (sandwiched) with tie bar.

* Parts are packaged in non-JEDEC trays.

* Due to the custom nature of the package, body size and dimensions can change without notice.

* Parts available with a daisy-chain configuration upon request.

* Other ceramic packages available upon request.

* Glass or epoxy seal.

* Footprint compatible with plastic QFP packages.

* EIAJ and JEDEC standards.

* Lead-frames are embedded into the glass to create both internal die connection and external PCB connection.

Part Description System