Practical Components

Tessera - TV208

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• 2–metal utilizes substrate enabling high density and high performance.
• Small chip-size footprint and low profile enables small form factor solutions.
• No under-fill is needed, providing the option to rework.
• JEDEC level 1 moisture resistance eliminates the need for special packaging and handling.
• Unique compliant layer relieves thermo-mechanical stress providing superior reliability.
• Exposed back surface of the die provides excellent thermal junction for efficient thermal management.
• Short lead length provides excellent electrical characteristics.
• Lightweight for portable designs.