Practical Components

The PB08 daisy-chain test die is designed with an 8-mil (203µm) solder bump pitch around the perimeter of the device. Each die contains 99 I/O (44 daisy-chain pairs). The device comes in two sizes: 200mil x 200mil and 400mil x 400mil. The PB08-400x400 device consists of a 4 PB08-200x200 devices without the inner I/O’s bumped.

The PB18 daisy-chain test die is designed with an 18-mil solder bump pitch around the perimeter of the device. Each die contains 48 I/O (24 daisy-chain pairs). The device comes in two sizes: 250mil x 250mil (6.35mm x 6.35mm) and 500mil x 500mil (12.7mm x 12.7mm). The PB18-500x500 device consists of 4 PB18-250x250 devices without the inner I/O’s bumped.

The FA10 daisy-chain test die is designed with a 10- mil pitch (254µm) array of solder bumps across the surface of the die. They are configured in “quad” structures for versatile assembly and evaluation options. The array pattern is an 18 row x 18 column footprint minus four pairs of corner bumps. The addition of a key bump in the upper left corner addresses alignment requirements. Each die contains 317 I/O (158 daisy-chain pairs). This device is offered with eutectic or Pb-free solder bumps.