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Pb-Free HASL PCB Finish Now Available!

One of the most popular final finishes is known as Hot Air Surface Leveling otherwise known as HASL. A viable lead free HASL process utilizing the Nihon Superior SN100CL lead free solder alloy is available. Testing to date has shown that the SN100CL lead free HASL process offers superior solderability to the final finishes on the market today. All of the final finishes available on the market today have both their merits and demerits. Many in the board industry are concerned about switching from HASL to a less forgiving final finish as they transition to the up and coming lead free era. Our process should ease these concerns. This process is also directed towards those who are not completely satisfied with their current final finish. There are two major lead free solder alloys on the market today: SN100CL and the SAC alloy. The SN100CL nominal composition is a stabilized eutectic tin copper . The SAC 305 alloy consists of tin, copper and 3% silver.

The Advantages of SN100CL Lead-Free HASL:

  • A robust process.
  • Improved shelf life compared to 63/37 (2).
  • Minimal temperature increase in the solder pot (Solder pot temp est.
    485-500°F).
  • No copper attack (e.g., copper traces, holes on circuit board).
  • Minimal stainless steel attack. SAC 305 alloy rapidly attacks Stainless Steel.
  • Superior wetting yielding a more uniform and flat surface.
  • Capable of handling very fine pitch due to excellent wetting.
  • Compatible with both conventional 63/37 and lead free final assembly.
  • More economical (No Silver).

Call Practical for availability.

 

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