Practical Components

PACTECH Flip Chip Test & Evaluation Kit and Board

PC Boards and Kits

• PC052 B52 CRET Cleanliness & Residue Evaluation Test Kit
• PC009-40 Aegis Traceability & Control Validation Kit
• Kit Identifier (component part/kit numbers)
• AIM Print Test Board and Kit
• Pb-Free HASL PCB Finish
• Custom PC Practice Boards and Kits
• CircuitCAM Software—Aegis
• Single Pack Hand Solder Kits
• PC000 Zero-Ohm SMD Resistor PCB/ Kit
• PC003 Solder Practice PCB/Kit
• PC005 BGA Variable Pitch and Array PCB/Kit
• PC007 MLF® Test PCB/Kit
• PC008 Solder Practice PCB/Kit
• PC009 Mixed Technology PCB/Kit
• PC011 BGA Fine Pitch PCB/Kit
• SMTA Saber Evaluation PCB/Kit
• PC012 BGA Global Daisy-Chain Test Kit
• PC013 Though-Hole Solder Training Kit
• PC014 IPC 9850 Attribute Defect Rate Kit
• PC015 Rework Kits
• PC016 IPC Compliant Hand Soldering Kit
• PC020 Practical SMT Kit
• PCB 049- Indium MT/PTH Mixed Technology Board and Kit
• PC200 PoP 14mm Board & Kit—Amkor
• PC200 PoP 12mm Board & Kit—Amkor
• PCB200 15mm Thermal Cycle Board
• PCB200 15mm Drop Test Board
• PCB310 Flip Chip Board - Pac Tech
• SIR Test board and Kit
• WTK-1 Terminal and Wire Kit
• PC031 Lead-Free Process Capability Validation Kit—Cookson
• Flip Chip Test Die Kits—FlipChip Int'l
• µBGAPC Boards and Kits—Tessera
• Omni Training Kits
• Laser Cut Metal Mask Stencils

Nearly all package types are now available in lead-free formulations and dummy packages are available as small as 0402 metric.

FREE CATALOG

See our illustrated design guide/catalog for an extensive list of dummy components, SMD production tools and equipment, PCB practice kits and other products designed to save you money and improve your process.

The PACTECH Flip Chip Test & Evaluation board is for placement and daisy chain continuity testing after assembly. Substrate has 28 mounting sites for 10 x 10mm Flip Chips.

With an increasing number of I/O’s on Integrated Circuits and accompanying requirements for high performance, flip chip type components are a compelling technology for potential users. PACTECH test die are combined with test boards to provide customers with the ability to test a variety of specs and processes. Both components and test boards are daisy-chained for continuity.

The PCB310-PacTech Board is single sided with 28 pads to accommodate 4 rows of 7 Flip Chips each. Rows 1 and 4 accommodate the Pac2.1-PB184-200-10mm Die. While rows 2 and 3 accommodate the Pac2.3-FA572-200/400-10mm Die.

Notes

• Board size is -6.3x3.95", 2 layers, .062" thick.
• Board material is IS410-High Temp 180Tg.
• Standard board nish OSP Entek CU-A-HT.
• Gerber and X,Y Theta data included at no charge.
• See page 26 for available solder ball alloys.

Order Number: 12299 PCB310-PACTECH (board only)
Order Number: 12308 Pac2.1-PB184-200-10mm-DC-305 (Rows 1 and 4)
Order Number: 12312 Pac2.3-FA572-200/400-10mm-DC-305 (Rows 2 and 3)

For more information, see the Flip Chip Product page.