Practical Components

PoP (Package on Package) 15mm Board and Kit

PC Boards and Kits

• PC052 B52 CRET Cleanliness & Residue Evaluation Test Kit
• PC009-40 Aegis Traceability & Control Validation Kit
• Kit Identifier (component part/kit numbers)
• AIM Print Test Board and Kit
• Pb-Free HASL PCB Finish
• Custom PC Practice Boards and Kits
• CircuitCAM Software—Aegis
• Single Pack Hand Solder Kits
• PC000 Zero-Ohm SMD Resistor PCB/ Kit
• PC003 Solder Practice PCB/Kit
• PC005 BGA Variable Pitch and Array PCB/Kit
• PC007 MLF® Test PCB/Kit
• PC008 Solder Practice PCB/Kit
• PC009 Mixed Technology PCB/Kit
• PC011 BGA Fine Pitch PCB/Kit
• SMTA Saber Evaluation PCB/Kit
• PC012 BGA Global Daisy-Chain Test Kit
• PC013 Though-Hole Solder Training Kit
• PC014 IPC 9850 Attribute Defect Rate Kit
• PC015 Rework Kits
• PC016 IPC Compliant Hand Soldering Kit
• PC020 Practical SMT Kit
• PCB 049- Indium MT/PTH Mixed Technology Board and Kit
• PC200 PoP 14mm Board & Kit—Amkor
• PC200 PoP 12mm Board & Kit—Amkor
• PCB200 15mm Thermal Cycle Board
• PCB200 15mm Drop Test Board
• SIR Test board and Kit
• WTK-1 Terminal and Wire Kit
• PC031 Lead-Free Process Capability Validation Kit—Cookson
• Flip Chip Test Die Kits—FlipChip Int'l
• µBGAPC Boards and Kits—Tessera
• Omni Training Kits
• Laser Cut Metal Mask Stencils

Nearly all package types are now available in lead-free formulations and dummy packages are available as small as 0402 metric.

FREE CATALOG

See our illustrated design guide/catalog for an extensive list of dummy components, SMD production tools and equipment, PCB practice kits and other products designed to save you money and improve your process.

The 15mm Package on Package (PoP) Thermal Cycling Test Board is designed for use with Amkor’s new 15mm PoP components.  Both top and Bottom components can be mounted on the board and connected with a daisy chain pattern to the test board.

Thermal Cycling is a diagnostic test for electronic assemblies.  The test is severe on solder joints that are under both compressive and tensile strain during cycling as a result of differential thermal expansion.

The new 15mm PoP Thermal Cycle Test will allow customers to conduct valuable process testing on new technology components.

Notes

• Board size is 132 x 77mm, 8–layers, .039" thick, no microvias.
• Board material is IS-410 High Temp. 180Tg.
• Standard board finish is OSP Entek CU-106A-HT.
• 15 daisy-chain pad placements for 15x15 604 PSvfBGA component.
• Immersion Silver board finish is available upon special request. MOQ may apply.
• Gerber and X,Y Theta data included at no charge.

Order Number: 19952 PCB200-15mm-TC (board only)
Order Number: 31426 A-PoP160-.65mm 15mm-DC-LF-105 (top component only)
Order Number: 31427 A-PSvfBGA604-.5mm-25mm-DC-LF-125Ni (bottom component only)