Practical Components

PoP (Package on Package) 12mm
Board and Kit - Lead-Free Test Kit

PC Boards and Kits

• PC009-40 Aegis Traceability & Control Validation Kit
• Kit Identifier (component part/kit numbers)
• AIM Print Test Board and Kit
• Pb-Free HASL PCB Finish
• Custom PC Practice Boards and Kits
• CircuitCAM Software—Aegis
• Single Pack Hand Solder Kits
• PC000 Zero-Ohm SMD Resistor PCB/ Kit
• PC003 Solder Practice PCB/Kit
• PC005 BGA Variable Pitch and Array PCB/Kit
• PC007 MLF® Test PCB/Kit
• PC008 Solder Practice PCB/Kit
• PC009 Mixed Technology PCB/Kit
• PC011 BGA Fine Pitch PCB/Kit
• SMTA Saber Evaluation PCB/Kit
• PC012 BGA Global Daisy-Chain Test Kit
• PC013 Though-Hole Solder Training Kit
• PC014 IPC 9850 Attribute Defect Rate Kit
• PC015 Rework Kits
• PC016 IPC Compliant Hand Soldering Kit
• PC020 Practical SMT Kit
• PC200 PoP 14mm Board & Kit—Amkor
• PC200 PoP 12mm Board & Kit—Amkor
• WTK-1 Terminal and Wire Kit
• PC031 Lead-Free Process Capability Validation Kit—Cookson
• Flip Chip Test Die Kits—FlipChip Int'l
• µBGAPC Boards and Kits—Tessera
• Omni Training Kits
• Laser Cut Metal Mask Stencils

Nearly all package types are now available in lead-free formulations and dummy packages are available as small as 0402 metric.

FREE CATALOG

See our illustrated design guide/catalog for an extensive list of dummy components, SMD production tools and equipment, PCB practice kits and other products designed to save you money and improve your process.

This PoP 12mm Board and Kit is designed as test vehicle for the new Amkor (PSvfBGA) 12x12 305 PoP package. PoP packages from Amkor focus on high density logic devices. PoP packages are designed for products such as cell phones, digital cameras and other mobile applications benefiting from the combination of stacked packages and small footprint technology. This test board enables the end user to test their process applications on the top and bottom PoP components. With daisy-chain patterns in both packages and the PCB200 Board, customers are able to check for continuity to guarantee the integrity of their process.

Notes

• Board size is 132 x 77mm, 8-layers, .039" thick, no microvias
• Board material is IS-410 High Temp 180Tg
• Standard board finish OSP Entek CU-106A-HT
• Immersion Silver finish is also available upon special request. MOQ may apply
• 15 daisy-chain pad placements for 12x12 305 PoP component
• Gerber and X,Y Theta data included at no charge

Inquire for available solder ball alloys for PoP components. SAC305, SAC405, SAC105 and SAC125Ni are available.

See: Amkor PoP

Order Number: PCB200-12mm (board only)
Order Number: 31288 A-PoP128-.65mm12mm-DC-SAC105 (top component only)
Order Number: 31289 A-PSvfBGA305.5mm-12mm-DC-SAC125Ni (bottom component only)