Practical Components
dummy components, tools and kits
Flip Chip Test Die Kits
PC Boards and Kits
- PC009-40 Aegis Traceability & Control Validation Kit
- Kit Identifier (component part/kit numbers)
- AIM Print Test Board and Kit
- Pb-Free HASL PCB Finish
- Custom PC Practice Boards and Kits
- CircuitCAM Software—Aegis
- Single Pack Hand Solder Kits
- PC000 Zero-Ohm SMD Resistor PCB/ Kit
- PC003 Solder Practice PCB/Kit
- PC005 BGA Variable Pitch and Array PCB/Kit
- PC007 MLF® Test PCB/Kit
- PC008 Solder Practice PCB/Kit
- PC009 Mixed Technology PCB/Kit
- PC011 BGA Fine Pitch PCB/Kit
- SMTA Saber Evaluation PCB/Kit
- PC012 BGA Global Daisy-Chain Test Kit
- PC013 Though-Hole Solder Training Kit
- PC014 IPC 9850 Attribute Defect Rate Kit
- PC015 Rework Kits
- PC016 IPC Compliant Hand Soldering Kit
- PC020 Practical SMT Kit
- PC200 PoP 14mm Board & Kit—Amkor
- PC200 PoP 12mm Board & Kit—Amkor
- WTK-1 Terminal and Wire Kit
- PC031 Lead-Free Process Capability Validation Kit—Cookson
- Flip Chip Test Die Kits—FlipChip Int'l
- µBGAPC Boards and Kits—Tessera
- Omni Training Kits
- Laser Cut Metal Mask Stencils
FREE CATALOG
See our illustrated design guide/catalog for an extensive list of dummy components, SMD production tools and equipment, PCB practice kits and other products designed to save you money and improve your process.
With an increasing number of I/O’s on Integrated Circuits and accompanying requirements for high performance, flip chip type components become a compelling technology for potential users. Flip Chip Technology test die are combined with factory designed test boards to provide customers with the ability to test a variety of die specs, bump pitches and bump counts. Both components and test boards are daisy-chained for continuity.
Quick Link to: Flip Chip Components
PB18-25x250 Laminate Board
Laminate board is double-sided board. One side has 10 pads for the PB18-250x250, the other side has 10 pads for the PB18-500x500.
Substrate Information
- Board Type—High Temp FR4 (Tg = 176°C)
- Board Thickness—0.031" or 0.062"
- Layers—4 (top, bottom, ground, power) inner layers nonfunctional
- Copper Conductor—1 oz. Cu
- Solder Mask—Taiyo PSR-4000
- Test Site Die—10 (250 x 250 mil2) sites on one side of the board
- Pitch—18 mil
- Minimum Line—6 mil
- Maximum Space—12 mil
- Test Site Die—10 (500 x 500 mil2) sites on one side of the board
- Pitch—18 mil
- Minimum Line—6 mil
- Maximum Space—12 mil
Order Number (board only): PB18-250/500 Laminate
- Kit quantities are subject to change.
- Mix and match components and quantities to create a custom kit. Please contact your sales representative for details.
- PC Board is double-sided (top side for 1.0mm pitch packages / bottom side for 1.27mm pitch package).
- Gerber and X, Y Theta data included at no charge.
- Digitized files provided by Aegis Software included at no charge.
| PB18-250x250 Kits | |||||
|---|---|---|---|---|---|
| Part Description | Qty Per 1 Kit |
Qty Per 5 Kits |
Qty Per 10 Kits |
Qty Per 15 Kits |
Qty Per 20 Kits |
| PB18-250-DC | 10 | 50 | 100 | 150 | 200 |
| PB18-250/500 Laminate | 1 | 5 | 10 | 15 | 20 |
| Kit Order Number: | PB18-250-001 | PB18-250-005 | PB18-250-010 | PB18-250-015 | PB18-250-020 |
| PB18-500x500 Kits | ||||
|---|---|---|---|---|
| Part Description | Qty Per 1 Kit |
Qty Per 5 Kits |
Qty Per 10 Kits |
Qty Per 15 Kits |
| PB18-500-DC | 10 | 50 | 100 | 150 |
| PB18-250/500 Laminate | 1 | 5 | 10 | 15 |
| Kit Order Number: | PB18-500-001 | PB18-500-005 | PB18-500-010 | PB18-500-015 |
- Lead-free parts are available.
- Digitized files provided by Aegis Software included at no charge.
PB08-2x2 Laminate Board
Laminate board is double sided. One side has 10 pads for the PB8-2x2 (back side is no longer available for the PB8-4x6, this part has been discontinued).
Substrate Information
- Board Type—High Temp FR4
- Board Thickness—0.062"
- Layers—4 (top, bottom, ground, power) inner layers nonfunctional
- Copper Conductor—1/4 oz. or 1/2oz. Cu
- Solder Mask—Taiyo PSR-4000
- Test Site Die—10 (200 x 200 mil2) sites on one side of the board
- Pitch—8 mil
- Minimum Line—4mil
- Minimum Space—4 mil
- Wettable Cu Pad—4 x 8 mil2 (defined using a solder mask)
- Purpose—Flip Chip on FR-4 board with daisy-chain structure
Board Size: 3.5" x 5.5"
Order Number: PB08-2x2-Laminate PCB
| PB08-200x200 Kits | |||||
|---|---|---|---|---|---|
| Part Description | Qty Per 1 Kit |
Qty Per 5 Kits |
Qty Per 10 Kits |
Qty Per 15 Kits |
Qty Per 20 Kits |
| PB08-200x200-DC | 10 | 50 |
100 | 150 | 200 |
| PB08 Laminate Board | 1 | 5 | 10 | 15 | 20 |
| Kit Order Number: | PB8-2x2-001 | PB8-2x2-005 | PB8-2x2-010 | PB8-2x2-015 | PB8-2x2-020 |
- Digitized files provided by Aegis Software included at no charge.
FA10-2x2 Laminate Board
Laminate is only available for FA10-2x2. Single-sided pattern.
Substrate Information
- Board Type—High Temp FR4
- Board Thickness—0.031"
- Layers—4 (top, bottom, ground, power) inner layers nonfunctional
- Copper Conductor—1/4 oz. or 1/2oz. Cu
- Solder Mask—Taiyo PSR-4000
- Test Site Die—10 (200 x 200 mil2) sites on one side of the board
- Pitch—10 mil array
- Minimum Line—4 mil
- Minimum Space—4 mil
- Wettable Cu Pad—5 mil diameter, round
- Through-Hole Via—8 mil drill, 10 mil; capture pad
Board Size: 3.5" x 5.5"
Order Number (board only): FA10-2x2-PCB
| FA10-200x200 Kits | |||
|---|---|---|---|
| Part Description | Qty Per 1 Kit |
Qty Per 5 Kits |
Qty Per 10 Kits |
| FA10-200x200-DC | 10 | 50 | 100 |
| FA10 Laminate | 1 | 5 | 10 |
| Kit Order Number: | FA10-2x2-001 | FA10-2x2-005 | FA10-2x2-010 |
- Digitized files provided by Aegis Software included at no charge.
