Practical Components

PC2006

AIM Print Test Board and Kit

PC Boards and Kits

• PC052 B52 CRET Cleanliness & Residue Evaluation Test Kit
• PC009-40 Aegis Traceability & Control Validation Kit
• Kit Identifier (component part/kit numbers)
• AIM Print Test Board and Kit
• Pb-Free HASL PCB Finish
• Custom PC Practice Boards and Kits
• CircuitCAM Software—Aegis
• Single Pack Hand Solder Kits
• PC000 Zero-Ohm SMD Resistor PCB/ Kit
• PC003 Solder Practice PCB/Kit
• PC005 BGA Variable Pitch and Array PCB/Kit
• PC007 MLF® Test PCB/Kit
• PC008 Solder Practice PCB/Kit
• PC009 Mixed Technology PCB/Kit
• PC011 BGA Fine Pitch PCB/Kit
• SMTA Saber Evaluation PCB/Kit
• PC012 BGA Global Daisy-Chain Test Kit
• PC013 Though-Hole Solder Training Kit
• PC014 IPC 9850 Attribute Defect Rate Kit
• PC015 Rework Kits
• PC016 IPC Compliant Hand Soldering Kit
• PC020 Practical SMT Kit
• PCB 049- Indium MT/PTH Mixed Technology Board and Kit
• PC200 PoP 14mm Board & Kit—Amkor
• PC200 PoP 12mm Board & Kit—Amkor
• SIR Test board and Kit
• WTK-1 Terminal and Wire Kit
• PC031 Lead-Free Process Capability Validation Kit—Cookson
• Flip Chip Test Die Kits—FlipChip Int'l
• µBGAPC Boards and Kits—Tessera
• Omni Training Kits
• Laser Cut Metal Mask Stencils

Nearly all package types are now available in lead-free formulations and dummy packages are available as small as 0402 metric.

FREE CATALOG

See our illustrated design guide/catalog for an extensive list of dummy components, SMD production tools and equipment, PCB practice kits and other products designed to save you money and improve your process.

CircuitCam™ & Digitized Gerber Files

The AIM print test board was designed to include many printing challenges
which are commonly encountered on manufacturers assemblies.
In addition to BGA and Micro BGA pads, both have circular and square
pad design to test paste release. AIM has included the standard IPC
slump test pattern in order to further challenge the properties of any
product tested thereon. This print pattern is more real life and more
accurate to predict slump since individual pads are used instead of one
pad that is common in the “thermometer” method. There is a number on
the board indicating the distances between pads so a hard number can
be used for paste evaluations.

Board material is FR4 170Tg.
Standard finish: ImAg.

Kit Order Number: PC2006-0-20

Notes

• Digitized gerber files provided by Aegis Software includes at no charge.
• Kit available with Pb-free components.