Practical Components
dummy components, tools and kits
µBGA®
Micro Ball Grid Array
The µBGA® package is a chip scale package. A polyimide film and metal layer tape form the interconnect leads for the package. The package is attached to the tape by a low stress elastomeric adhesive. The leads are bonded from the tape in an “s” shape to chip bond pads. A low stress encapsulate covers the bond leads, and eutectic solder balls are attached to pads on the tape.
Quick Link to: µBGA PC Boards and Kits
| µBGA™ Micro Ball Grid Array | ||||
|---|---|---|---|---|
| Drawings | Part Number | I/O Count |
Pitch | Body Size |
| TV-46 | TV-46 Tape | 46 | .75mm | 5.76 x 7.87mm |
| TV-62 | TV-62 Tape | 62 | .8mm | 9.3 x 11.5mm |
| TV-208 | TV-208 Tape | 208 | .5mm | 9.28mm sq |
| TV-256 Tape | 92 | .8mm | 9.5 x 16.5mm | |
- Parts are packaged in waffle trays.
- Parts have eutectic 63/37 SnPb solder bumps.
- Parts are daisy-chained.
- Call for tape and reel quantity and availability.
- TV-256 is a 256Mb RDRAM® device in a chip scale package.
- Moisture sensitivity classification JEDEC level 1.
| µBall Grid Array Lead Free | ||||
|---|---|---|---|---|
| Drawings | Part Number | I/O Count |
Pitch | Body Size |
| TV-46 | TV-46 Tape Sn/Ag | 46 | .75mm | 5.76 x 7.87mm |
| TV-46 Tape Sn/Ag/Cu | 46 | .75mm | 5.76 x 7.87mm | |
| TV-62 | TV-62 Tape Sn/Ag | 62 | .8mm | 9.3 x 11.5mm |
| TV-62 Tape Sn/Ag/Cu | 62 | .8mm | 9.3 x 11.5mm | |
| TV-208 | TV-208 Tape Sn/Ag | 208 | .5mm | 9.28mm sq |
| TV-208 Tape Sn/Ag/Cu | 208 | .5mm | 9.28mm sq | |
| TV-256 Tape Sn/Ag | 92 | .8mm | 9.5 x 16.5mm | |
| TV-256 Tape Sn/Ag/Cu | 92 | .8mm | 9.5 x 16.5mm | |
- There are two lead-free alloys available:
- 96.5% Sn/ 3.5% Ag (tin/silver)
- 96.5% Sn/ 3.0% Ag/ 0.5% Cu (tin/silver/copper)—Most Popular
- Lead-free application notes available upon request.
