Practical Components
dummy components, tools and kits
CTBGA Specifications
Nearly all package types are now available in lead-free formulations and dummy packages are available as small as 0402 metric.FREE CATALOG
See our illustrated design guide/catalog for an extensive list of dummy components, SMD production tools and equipment, PCB practice kits and other products designed to save you money and improve your process.
Go to CTBGA ChipArray Thin Core Ball Grid Array
| Package Pitch | A | B | C | D |
|---|---|---|---|---|
| 1.0/0.8mm | 0.46mm | 0.48mm (±0.05mm) | 0.36mm (±0.05mm) | 0.30mm (±0.05mm) |
| 0.75mm/0.5mm | 0.30mm | 0.32mm (±0.50mm) | 0.19mm (±0.05mm) | 0.17mm (±0.03mm) |
Note: Typical motherboard non-solder mask defined pad:
- 0.50 pitch = 0.28
- 0.80 pitch = 0.30
- 1.00 pitch = 0.38
Go to CTBGA ChipArray Thin Core Ball Grid Array
