Practical Components
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Ultra CSP™
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Amkor’s Ultra CSP™ package was licensed from Kulicke & Soffa Inc.’s Flip Chip Division as it’s standard wafer level package offering. The Ultra CSP™ has been widely adopted as the industry standard for cost effective, high performance wafer level CSP applications. This package incorporates a thin film redistribution process to routethe pad to JEDEC/EIAJ standard pitches. Conventional CSP solderbumps are formed on the re-routed pads. It is designed to utilize industry-standard surface mount assembly and reflow techniques.Lead-free is also available with Sn/Ag/Cu composition.
Quick Link to: Ultra CSP Drawings
One Layer Ultra CSP Bump™ on I/0
| Ultra CSP™ | ||||
|---|---|---|---|---|
| Part Number | I/O Count |
Pitch | Body Size |
Qty Per Tray |
| A-UCSP98-.5mm-7.2x6.7mm | 98 | .5mm | 7.2 x 6.7mm | 25 |
| A-UCSP192-.4mm-7mm | 192 | .4mm | 7mm | 25 |
- Compatible with conventional SMT assembly and test techniques.
- No need for underfill in many applications.
- Moisture sensitivity is JEDEC level 1 @ 240°C Sphere ball diameter is 300µm (min.) for 0.5mm pitch and 250µm (min.) for 0.4mm pitch.
- Bond pad pitch 90µm (minimum).
- Solder ball material is Eutectic 63/37 SnPb.
- Lead-free is available with Ag/Cu/Sn composition.
- Die thickness is 0.36—0.73mm.
- Dielectric material is Benzoclyclobutene (BCB).
- 0.4mm and 0.5mm ball pitches.
- Parts are packaged in waffle pack trays.
