Practical Components
dummy components, tools and kits
TQFP
Thin Quad Flat Pack
Quad Flat Pack
- LQFP Low Profile Quad Flat Pack
- LQFP PowerQuad 2, 4 —Amkor
- TQFP Thin Quad Flat Pack—Amkor
- QFP Plastic Quad Flat Pack
- QFP PowerQuad 2—Amkor
- CQFP Ceramic Quad Flat Pack
- LCC Leadless Ceramic Carrier
- BQFP Bumpered Quad Flat Pack
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Quick Link to: TQFP Component Drawings
Thin Quad Flat Pack (TQFP) packages provide the same benefit of the metric QFP package, but are thinner (body thickness of 1.0mm) and have a standard lead-frame footprint (2.0mm lead footprint). TQFPs are helping to solve issues such as increasing board density, die shrink programs, thin end-product profile and portability. Lead counts range from 32 to 176. Body sizes range from 5 x 5mm to 20 x 20mm. Copper lead-frames are used for the TQFP package. Lead pitches available for TQFP package are 0.4mm, 0.5mm, 0.65mm 0.8mm and 1.0mm.
- TQFP is available in die up configurations in 1.0mm thickness only.
- 5 x 5mm to 20 x 20mm body size (JEDEC Standard).
- Copper leadframes.
- 1.0mm body thickness for TQFP.
- Moisture sensitivity is JEDEC level 3.
- Lead-free parts are available with SnBi or 100% Matte Sn finish.
- * = Available as an Exposed Pad L/TQFP Package by Amkor. The
- ExposedPad™ L/TQFP can increase heat dissipation by as much as 110%
- over a standard L/TQFP. The ExposedPad™ L/TQFP is a cost effective,
- high frequency leadframe solution to thermal management when the
- die attach pad is soldered to the PCB.
