Practical Components
dummy components, tools and kits
TMV
TMV® PoP (Through Mold Via Package on Package)
Passives, Resistors, Discretes
- SMR Lead-Free Surface Mount Resistors
- Zero-Ohm Jumper Resistors
- SMTA Surface Mount Molded Tantalum Capacitors
- MELF Resistors
- SMC Surface Mount Multilayer Ceramic Capacitors
- SMC Lead-Free Surface Mount Ceramic Capacitors
- SMC Wide Terminations Surface Mount Ceramic Capacitors
- SME Surface Mount Electrolytic Capacitors
- MELF Diodes
- SMT Surface Mount Transitors
- Chip Inductors
FREE CATALOG
See our illustrated design guide/catalog for an extensive list of dummy components, SMD production tools and equipment, PCB practice kits and other products designed to save you money and improve your process.
Amkor has added a new higher density PoP structure using through mold via TMV® technology. TMV enables single or stacked die structures in the bottom package using both wirebond and flip chip interconnection.
The Amkor TMV® PoP technology provides several key benefits:
- Enables scaling of the PoP stacked interface to 0.4 mm pitch in support of emerging high-density memory architectures.
- Allows for larger silicon area within an existing package footprint, benefiting both system architects and IC designers.
- Supports flip chip, wirebond, stacked die and passive integration within the bottom package for increased integration and design flexibility.
- Provides for reduced package warpage enabling thinner PoP stacks and improved surface mount assembly for high-density fine-pitch applications. PoP packages provide a platform to cost effectively expand options for logic and memory 3-D integration.
Part Description |
I/O |
Pitch |
Body |
Quantity |
A-TMVPoP200-.5-14mm-DC-105 |
200 |
.5mm |
14mm |
119 |
A-TMVPSvfBGA620-.4-14mm-DC-125 |
620 |
.4mm |
14mm |
119 |
Body |
Foot Print-top (b) |
Foot Print-bottom (c) |
Die (d) |
14x14mm |
0.50 pitch, 200 pad |
0.4 pitch, 620 BGA |
7.6x7.6mm |
Part Numbers:
A-TMVPoP200-.5-14mm-DC-105 (PN 31557)
A-TMVPSvfBGA620-.4mm-14mm-DC-125 (PN 31558)
