Practical Components

A revolutionary new concept, Amkor and ASAT's cross-licensed package tsMLF This Substrate Micro LeadFrame (previously named TAPP) is a leadless, Pb-free and multi-row packaging solution. The very thin, fine-pitch package with an exposed die attach pad allows for improved thermal performance and a power/ground ring option for enhanced electrical characteristics. The tsMLF offers a superior solution for high-performance and chip scale applications. tsMLF can be made to fit the footprint of Dual Row MicroLeadFrame® or can even be made with 3 rows of I/O. Dual Row MicroLeadFrame® has limited flexibility with the footprint except for depopulation as required.

For more information see Amkor's parts index: www.amkor.com/products/parts/index.cfm