Practical Components
dummy components, tools and kits
TABGA™
TapeArray BGA
Ball Grid Array
- CVBGA Very Thin Chip Array® BGA —Amkor
- CABGA Chip Array® BGA —Amkor
- TapeArray® BGA—Amkor
- CTBGA ChipArray® Thin Core Ball Grid Array —Amkor
- PBGA Plastic Ball Grid Array —Amkor
- PBGA Plastic Ball Grid Array Pitch
- SuperBGA®—Amkor
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The TapeArray™ (TABGA) package is a near chip scale (CSP). The package has a die-up, wire bonded configuration with a flexible circuit substrate and an over-molded body. The TapeArray™ expands the existing packaging of the fleXBGA® by streamlining the assembly process into an array strip format. The package is then singulated by saw as part of the EOL process. The fine line features of the tape substrate offer reduced conductor and wirebond finger pitch to offer the highest I/O density solutions for a wide range of applications.
Quick Link to: TapeArray Solder Information
| TABGA TapeArray BGA | ||||||
|---|---|---|---|---|---|---|
| Part Number | I/O Count |
Pitch | Body Size |
Ball Matrix |
Ball Alignment |
Qty Per Tray |
| .5mm Pitch | ||||||
| A-TArray48-.5mm-5mm | 48 | .5mm | 5mm | 8 x 8 | Perimeter | 624 |
| A-TArray64-.5mm-6mm* | 64 | .5mm | 6mm | 10 x 10 | Perimeter | 608 |
| A-TArray80-.5mm-7mm | 80 | .5mm | 7mm | 12 x 12 | Perimeter | 476 |
| A-TArray84-.5mm-6mm* | 84 | .5mm | 6mm | 10 x 10 | Perimeter | 608 |
| A-TArray96-.5mm-8mm* | 96 | .5mm | 8mm | 14 x 14 | Perimeter | 360 |
| A-TArray132-.5mm-8mm* | 132 | .5mm | 8mm | 14 x 14 | Perimeter | 360 |
| A-TArray228-.5mm-12mm* | 228 | .5mm | 12mm | 22 x 22 | Perimeter | 198 |
| .8mm Pitch | ||||||
| A-TArray100-.8mm-9mm | 100 | .8mm | 9mm | 10 x 10 | Full Array | 308 |
| A-TArray112-.8mm-10mm* | 112 | .8mm | 10mm | 11 x 11 | Perimeter | 250 |
| A-TArray144-.8mm-10mm* | 144 | .8mm | 10mm | 12 x 12 | Full Array | 250 |
| A-TArray180-.8mm-12mm* | 180 | .8mm | 12mm | 14 x 14 | Perimeter | 198 |
| 1.0mm Pitch | ||||||
| A-TArray-100-1.0mm-11mm | 100 | 1.0mm | 11mm | 10 x 10 | Full Array | 176 |
| A-TArray-256-1.0mm-17mm* | 256 | 1.0mm | 17mm | 16 x 16 | Full Array | 90 |
- * = DC available.
- Some components are available daisy-chained. Call for details.
- Parts are packaged in JEDEC trays when available.
- Solder ball material is Eutectic 63/37 SnPb.
- 48 to 256 ball counts.
- 5 to 17mm sq. body sizes.
- 1.1mm mounted height for 1.0mm and 0.8mm ball pitches.
- 1.0mm mounted height for 0.5mm ball pitch.
- Package substrate: Conductor Cu/Ni/Au Dielectric Polyimide.
- 1.0, 0.8, and 0.5mm ball pitches.
- Excellent solder joint reliability.
- Superior moisture resistance performance JEDEC level 3.
- JEDEC Compliant MO-195—0.5mm pitch
- MO-216—0.8mm pitch
- MO-192—1.0mm pitch
- Lead-free parts are available with 95.5% Sn/ 4.0% Ag/ 5% Cu alloy.
